Innovation
Existing technology
Wafers are processed one by one.
- Oxidation aperture sizes are controlled by the process time.
- Issues on non-uniform oxide aperture size on a wafer and on low reproducibility between wafer to wafer
- Even with in-situ monitoring tools, it is not possible to solve the issues on non-uniform oxide aperture size on a wafer.
- Issues on the stable quality control and improving production yields of VCSEL products.
RayIR technology
Multiple of wafers can be process at once.
- A physically limited and self-terminated oxidation process allows stable and uniform processes.
- Able to achieve uniform oxide aperture sizes on the wafer, wafer-to-wafer, and batch to batch process.
- Allows dramatic improvement in VCSEL production yields.
- Improved production throughput is possible as well.
- Expect to improve the VCSEL chip reliabilities especially on high power applications.